Display apparatus

ABSTRACT

A display apparatus includes a thin film transistor disposed in a display area of a substrate and a display device in the display area that is electrically connected to the thin film transistor, an encapsulation layer that protects the display device, at least one through portion formed in the display area that vertically penetrates the substrate and a plurality of layers stacked on the substrate, and a first groove and a second groove that are spaced apart from each other and that surround the at least one through portion. A flow-restriction portion is disposed in a region between the first groove and the second groove that protrudes upwards from the substrate and confines an organic encapsulation layer of the encapsulation layer.

CROSS-REFERENCE TO RELATED PATENT APPLICATION

This application is a continuation of U.S. application Ser. No.17/812,103, filed on Jul. 12, 2022 in the U.S. patent and TrademarkOffice, which is a continuation of U.S. application Ser. No. 16/933,523,filed on Jul. 20, 2020 in the U.S. patent and Trademark Office, which isa continuation of U.S. application Ser. No. 16/386,695, filed on Apr.17, 2019 in the U.S. patent and Trademark Office, which claims priorityunder 35 U.S.C. § 119 from, and the benefit of, Korean PatentApplication No. 10-2018-0093143, filed on Aug. 9, 2018 in the KoreanIntellectual Property Office, the contents of both of which are hereinincorporated by reference in their entireties.

BACKGROUND 1. Technical Field

One or more embodiments are directed to a display apparatus.

2. Discussion of the Related Art

Recently, on the front surface of display apparatuses, a display areafor displaying images has increased in size while physical buttons havebeen removed. For example, display apparatuses have been introduced inwhich a separate member, such as a camera that increases functionalityof a display apparatus, is disposed in a display area to minimize adecrease in the size of the display area. To dispose a separate member,such as a camera, in the display area, a groove or a through portionwhere the separate member is located needs to be formed in the displayarea. However, the groove or through portion in the display area mayprovide a new moisture infiltration path through which external moistureinfiltrates into the display area.

SUMMARY

One or more embodiments include display apparatuses that can preventinfiltration of external moisture or other contaminants through athrough portion in a display area.

According to one or more embodiments, a display apparatus includes asubstrate having a display area and a peripheral area outside thedisplay area; a thin film transistor disposed in the display area of thesubstrate; a display device electrically disposed in the display areathat is connected to the thin film transistor; an encapsulation layerthat protects the display device; at least one through portion formed inthe display area and that vertically penetrates the substrate and aplurality of layers stacked on the substrate; and a first groove and asecond groove that are spaced apart from each other and that surroundthe at least one through portion. The encapsulation layer includes afirst inorganic encapsulation layer, an organic encapsulation layer, anda second inorganic encapsulation layer sequentially stacked on eachother. The first groove and the second groove partition a non-displayarea between the at least one through portion and the display area intoa first region between the display area and the second groove, a secondregion between the first groove and the second groove, and a thirdregion between the first groove and the at least one through portion. Aflow-restriction portion is disposed in the second region that protrudesupwards from the substrate to confine the organic encapsulation layer.

The thin film transistor may include a semiconductor layer, a gateelectrode, a source electrode, and a drain electrode, and the pluralityof layers may include a gate insulating layer disposed between thesemiconductor layer and the gate electrode, an interlayer insulatinglayer between the gate electrode and the source and drain electrodes, aplanarization layer disposed on the thin film transistor, and a pixeldefining layer disposed on the planarization layer and that exposes acenter portion of a pixel electrode of the display device. The pluralityof layers may be disposed within the first region and the third region.

The flow-restriction portion may include a same material as a materialincluded in at least one of the planarization layer and the pixeldefining layer.

The display apparatus may further comprise a first detection portiondisposed on the pixel defining layer in the third region that protrudesupwards from an upper surface of the pixel defining layer.

The display apparatus may further comprise a second detection portionformed in an upper surface of the pixel defining layer in the thirdregion. The second detection portion may have a concave shape indentedin a thickness direction of the pixel defining layer.

The display apparatus may further comprise a third detection portiondisposed on the pixel defining layer in the first region that protrudesupwards from an upper surface of the pixel defining layer.

The display apparatus may further comprise a stepped portion formed inan end of the pixel defining layer in the first region that lowers aheight of the pixel defining layer, and a fourth detection portiondisposed on the stepped portion that protrudes upwards from the pixeldefining layer.

The gate insulating layer and the interlayer insulating layer may bedisposed in the second region between the substrate and theflow-restriction portion.

The organic encapsulation layer may fill an inside of the second groove,and the first inorganic encapsulation layer and the second inorganicencapsulation layer may contact each other in the first groove.

The substrate may include a first base layer, a first barrier layer, asecond base layer, and a second barrier layer sequentially stacked oneach other. Each of the first groove and the second groove may extendfrom the second barrier layer into a portion of the second base layer. Awidth of an upper portion of the first groove may be less than a widthof the inside of the first groove, and a width of an upper portion ofthe second groove may be less than a width of an inside of the secondgroove.

According to one or more embodiments, a display apparatus includes adisplay area and a peripheral area outside the display area; a substratethat includes a first base layer, a first barrier layer, a second baselayer, and a second barrier layer sequentially stacked on each other; adisplay device disposed on the second barrier layer in the display area;an encapsulation layer disposed on the display device and that protectsthe display device and extends from the display area into the peripheralarea; a through portion formed in the display area that penetrates thedisplay device in a thickness direction of the display device; a firstgroove that surrounds the through portion at a position spaced apartfrom the through portion; a second groove spaced apart from the firstgroove and that surrounds the first groove; and a flow-restrictionportion disposed between the first groove and the second groove thatprotrudes upwards from the substrate. Each of the first groove and thesecond groove penetrates from the second barrier layer into a portion ofthe second base layer, and the second groove is filled by an organicencapsulation layer of the encapsulation layer.

The encapsulation layer may further include a first inorganicencapsulation layer and a second inorganic encapsulation layerrespectively disposed on a lower surface and an upper surface of theorganic encapsulation layer, and the first inorganic encapsulation layerand the second inorganic encapsulation layer may contact each other inthe first groove.

The display device may include a pixel electrode, an opposite electrode,and an intermediate layer between the pixel electrode and the oppositeelectrode and that includes an emission layer. The display apparatus mayfurther include a thin film transistor electrically connected to thepixel electrode, a planarization layer disposed between the thin filmtransistor and the display device, and a pixel defining layer disposedon the planarization layer and that exposes a center portion of thepixel electrode. The planarization layer and the pixel defining layermay be disposed in a region between the through portion and the firstgroove and also in a region between the second groove and the displayarea.

The flow-restriction portion may include a same material as a materialincluded in at least one of the planarization layer and the pixeldefining layer.

The display device may further include a first detection portiondisposed on the pixel defining layer in the region between the throughportion and the first groove, wherein first detection portion protrudesupwards from an upper surface of the pixel defining layer.

The display device may further include a second detection portion formedon an upper surface of the pixel defining layer in the region betweenthe through portion and the first groove, wherein the second detectionportion has a concave shape indented in a thickness direction of thepixel defining layer.

The display device may further include a third detection portiondisposed on the pixel defining layer in the region between the secondgroove and the display area, wherein the third detection portionprotrudes upwards from an upper surface of the pixel defining layer.

The display device may further include a stepped portion formed at anend of the pixel defining layer in the region between the second grooveand the display area, wherein the stepped portion lowers a height of thepixel defining layer, and a fourth detection portion disposed on thestepped portion and that protrudes upwards from the pixel defininglayer.

The second barrier layer may include a pair of cantilever shaped firsttips that face each other in an upper end portion of the first groove,and a pair of cantilever shaped second tips that face each other in anupper end portion of the second groove.

According to one or more embodiments, a display apparatus includes asubstrate that includes a first base layer, a first barrier layer, asecond base layer, and a second barrier layer sequentially stacked oneach other, wherein the substrate includes a display area and aperipheral area outside the display area; an encapsulation layerdisposed on the substrate that extends from the display area into theperipheral area, wherein the encapsulation layer includes a firstinorganic encapsulation layer, an organic encapsulation layer, and asecond inorganic encapsulation layer sequentially stacked on each other;a through portion formed in the display area of the substrate thatpenetrates the substrate in a thickness direction of the substrate; afirst groove that surrounds the through portion at a position spacedapart from the through portion; a second groove spaced apart from thefirst groove and that surrounds the first groove; and a flow-restrictionportion disposed between the first groove and the second groove thatprotrudes upwards from the substrate. Each of the first groove and thesecond groove penetrates the second barrier layer into a portion of thesecond base layer, the first inorganic encapsulation layer and thesecond inorganic encapsulation layer contact each other in the firstgroove, and the second groove is filled by the organic encapsulationlayer.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic plan view of a display apparatus according to anembodiment;

FIG. 2 is a cross-sectional view taken along lines I-I′ and II-II′ ofFIG. 1 , according to an embodiment;

FIG. 3 is a magnified plan view of a portion A of FIG. 1 ;

FIG. 4 is a schematic plan view of a through portion of FIG. 3 ,according to an embodiment;

FIG. 5 is a cross-sectional view taken along line III-III′ of FIG. 4 ,according to an embodiment;

FIG. 6 is a cross-sectional view taken along line III-III′ of FIG. 4 ,according to another embodiment;

FIG. 7 is a cross-sectional view taken along line III-III′ of FIG. 4 ,according to another embodiment;

FIG. 8 is a cross-sectional view taken along line III-III′ of FIG. 4 ,according to another embodiment; and

FIG. 9 is a cross-sectional view taken along line III-III′ of FIG. 4 ,according to another embodiment.

DETAILED DESCRIPTION

Hereinafter, effects and features of embodiments of the presentdisclosure and a method for accomplishing them will be described morefully with reference to the accompanying drawings, in which embodimentsof the disclosure are shown. This disclosure may, however, be embodiedin many different forms and should not be construed as limited to theembodiments set forth herein.

It will be understood that when a layer, region, or component isreferred to as being “formed on” another layer, region, or component, itcan be directly or indirectly formed on the other layer, region, orcomponent.

Sizes of elements in the drawings may be exaggerated for convenience ofexplanation.

Exemplary embodiments of the disclosure will be described below in moredetail with reference to the accompanying drawings. Those componentsthat are the same or are in correspondence may have the same referencenumeral regardless of the figure number.

FIG. 1 is a schematic plan view of a display apparatus 10 according toan embodiment. FIG. 2 is a cross-sectional view taken along lines I-I′and II-II′ of FIG. 1 , according to an embodiment.

Referring to FIGS. 1 and 2 , according to an embodiment, the displayapparatus 10 includes a substrate 100 that has a display area DA wherean image is displayed, and a peripheral area PA located outside thedisplay area DA.

According to an embodiment, a display device is located in the displayarea DA, and the peripheral area PA includes a pad area in which variouselectronic devices or a printed circuit board (PCB) are electricallyattached.

According to an embodiment, a thin film transistor (TFT) 210 to whichthe display device is electrically connected is located in the displayarea DA, in addition to the display device. In FIG. 2 , the displaydevice in the display area DA is an organic light-emitting device (OLED)300. The OLED 300 is electrically connected to the TFT 210 and includesa pixel electrode 310 electrically connected to the TFT 210.

According to an embodiment, at least one through portion H is located inthe display area DA. The through portion H penetrates the displayapparatus 10 in a thickness direction of the display apparatus 10. Thethrough portion H is a space for accommodating a special member of thedisplay apparatus 10 or a member that adds a new function to the displayapparatus 10. For example, a plurality of through portions H can beformed in the display area DA, and a sensor, a light source, or a cameramodule can be located in each through portion H.

According to an embodiment, since the through portion H penetrates thesubstrate 100 and a plurality of layers stacked on the substrate 100,external moisture or oxygen can infiltrate into the display apparatus 10through sections of the display apparatus 10 that are exposed by thethrough portion H. However, according to an embodiment, a plurality ofgrooves that surround the through portion H are formed, therebyeffectively preventing the infiltration of moisture. The through portionH will be described in detail below with reference to FIG. 3 . In thefollowing description, a configuration of the display apparatus 10 isdescribed first with reference to FIG. 2 .

According to an embodiment, the substrate 100 includes variousmaterials. For a bottom-emission display apparatus that displays animage toward the substrate 100, the substrate 100 includes a transparentmaterial. However, for a top-emission display apparatus that displays animage away from the substrate 100, the substrate 100 does not need toinclude a transparent material. In this case, the substrate 100 includesa metal. The metal in the substrate 100 is at least one of iron (Fe),chrome (Cr), manganese (Mn), nickel (Ni), titanium (Ti), molybdenum(Mo), stainless steel (SUS), an Invar alloy, an Inconel alloy, or aKovar alloy.

For example, according to an embodiment, the substrate 100 has amulti-layered structure in which a first base layer 101, a first barrierlayer 102, a second base layer 103, and a second barrier layer 104 aresequentially stacked.

According to an embodiment, the first base layer 101 and the second baselayer 103 include, for example, a transparent glass material thatcontains SiO₂ as a main component. However, the materials included inthe first and second base layers 101 and 103 are not limited thereto,and the first base layer 101 and the second base layer 103 can include atransparent plastic material. The plastic material can bepolyethersulphone (PES), polyacrylate (PAR), polyetherimide (PEI),polyethylene naphthalate (PEN), polyethylene terephthalate (PET),polyphenylene sulfide (PPS), polyarylate, polyimide, polycarbonate (PC),cellulose triacetate (TAC), or cellulose acetate propionate (CAP).

According to an embodiment, the first base layer 101 and the second baselayer 103 may have the same or different thicknesses. For example, eachof the first base layer 101 and the second base layer 103 includespolyimide and has a thickness from about 3 μm to about 20 μm.

According to an embodiment, each of the first and second barrier layers102 and 104 prevents infiltration of external foreign materials into thedisplay apparatus 10 through the substrate 100, and may have a singlelayer or multiple layers that include an inorganic material, such asSiNx and/or SiOx. For example, the first barrier layer 102 is amulti-layer that includes an amorphous silicon layer and a silicon oxidelayer to improve adhesion between neighboring layers, and the secondbarrier layer 104 may be a silicon oxide layer. Each of the firstbarrier layer 102 and the second barrier layer 104 has a thickness fromabout 4000 Å to about 7000 Å, but embodiments of the present disclosureare not limited thereto.

According to an embodiment, a buffer layer is further formed on thesubstrate 100. The buffer layer planarizes an upper surface of thesubstrate 100 and block foreign matter or moisture from infiltratingthrough the substrate 100. For example, the buffer layer may include aninorganic material, such as silicon oxide, silicon nitride, siliconoxynitride, aluminum oxide, aluminum nitride, titanium oxide, ortitanium nitride, or an organic material, such as polyimide, polyester,or acryl, or may be formed as stacks of these materials. According tosome embodiments, the second barrier layer 104 of the substrate 100 is aportion of a multi-layered buffer layer.

According to an embodiment, the display area DA of the substrate 100includes the TFT 210 and further includes the display deviceelectrically connected to the TFT 210. FIG. 2 illustrates OLED 300 as anexemplary display device. A TFT may be disposed on the peripheral areaPA of the substrate 100. The TFT in the peripheral area PA is a portionof a circuit unit that control electrical signals transmitted to thedisplay area DA.

According to an embodiment, the TFT 210 includes a semiconductor layer211 that includes amorphous silicon, polycrystalline silicon, or anorganic semiconductor material, a gate electrode 213, a source electrode215, and a drain electrode 217. When the buffer layer is disposed on thesubstrate 100, the semiconductor layer 211 is disposed on the bufferlayer.

According to an embodiment, the gate electrode 213 is disposed on thesemiconductor layer 211, and the source electrode 215 and the drainelectrode 217 will electrically connect to each other in response to asignal received by the gate electrode 213. The gate electrode 213includes at least one of aluminum (Al), platinum (Pt), palladium (Pd),silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd),iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium(Ti), tungsten (W), or copper (Cu), and may have a single-layered ormulti-layered structure. To insulate the semiconductor layer 211 fromthe gate electrode 213, a gate insulating layer 120 that includes aninorganic material, such as silicon oxide, silicon nitride, or siliconoxynitride, is interposed between the semiconductor layer 211 and thegate electrode 213.

According to an embodiment, an interlayer insulating layer 130 isdisposed on the gate electrode 213 and includes an inorganic material,such as silicon oxide, silicon nitride, or silicon oxynitride, and mayhave a single-layered or multi-layered structure.

According to an embodiment, the source electrode 215 and the drainelectrode 217 are disposed on the interlayer insulation layer 130. Thesource electrode 215 and the drain electrode 217 are electricallyconnected to the semiconductor layer 211 via contact holes formed in theinterlayer insulation layer 130 and the gate insulating layer 120. Thesource electrode 215 and the drain electrode 217 include at least one ofaluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium(Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium(Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti),tungsten (W), or copper (Cu), and may have a single-layered ormulti-layered structure, based on considerations of conductivity, etc.

According to an embodiment, a protection layer is disposed on the TFT210 to protect the TFT 210. The protection layer includes an inorganicmaterial, such as silicon oxide, silicon nitride, or silicon oxynitride.The protection layer may have a single layer or a stack of multiplelayers.

According to an embodiment, a planarization layer 140 is disposed on theTFT 210. For example, when the OLED 300 is located above the TFT 210 asillustrated in FIG. 2 , the planarization layer 140 covers the TFT 210and planarize unevenness due to the TFT 210. The planarization layer 140includes an organic material, such as, acryl, benzocyclobutene (BCB) orhexamethyldisiloxane (HMDSO). Although the planarization layer 140 isshown as a single layer in FIG. 2 , embodiments are not limited thereto.For example, the planarization layer 140 may be a stack of multiplelayers. The display apparatus 10 according to a present embodiment mayinclude both the protection layer and the planarization layer 140. Inother embodiments, the display apparatus 10 includes only theplanarization layer 140.

According to an embodiment, the OLED 300 is disposed on theplanarization layer 140 within the display area DA of the substrate 100.The OLED 300 includes the pixel electrode 310, an opposite electrode330, and an intermediate layer 320 between the pixel electrode 310 andthe opposite electrode 330 and that includes an emission layer.

According to an embodiment, an opening formed in the planarization layer140 exposes at least one of the source electrode 215 and the drainelectrode 217 of the TFT 210, and the pixel electrode 310 iselectrically connected to the source electrode 215 or the drainelectrode 217 of the TFT 210 via the opening in the planarization layer140.

According to an embodiment, the pixel electrode 310 may be a transparentor semi-transparent electrode or a reflective electrode. When the pixelelectrode 310 is a transparent or semi-transparent electrode, the pixelelectrode 310 includes, for example, at least one of indium tin oxide(ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In₂O₃),indium gallium oxide (IGO), or aluminum zinc oxide (AZO). When the pixelelectrode 310 is a reflective electrode, the pixel electrode 310includes a reflective layer that includes at least one of silver (Ag),magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au),nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), or a compoundthereof, and a layer including at least one of ITO, IZO, ZnO, In₂O₃,IGO, or AZO. However, embodiments of the present disclosure are notlimited thereto, and the pixel electrode 310 may include any of variousother materials and may have any of various structures, such as, asingle-layered or multi-layered structure.

According to an embodiment, a pixel defining layer 150 is disposed overthe planarization layer 140. The pixel defining layer 150 has an openingthat defines a pixel by exposing at least a center portion of the pixelelectrode 310. In an embodiment illustrated in FIG. 2 , the pixeldefining layer 150 covers an edge of the pixel electrode 310, whichincreases a distance between the edge of the pixel electrode 310 and theopposite electrode 330 disposed over the pixel electrode 310 to preventan arc from occurring on the edge of the pixel electrode 310. The pixeldefining layer 150 includes an organic material, such as polyimide orHMDSO.

According to an embodiment, the intermediate layer 320 of the OLED 300includes the emission layer. The emission layer may include a lowmolecular weight or high molecular weight organic material that emitslight of a predetermined. The intermediate layer 320 further includes,in addition to the emission layer, at least one functional layerselected from a hole transport layer (HTL), a hole injection layer(HIL), an electron transport layer (ETL), and an electron injectionlayer (EIL). Such functional layers include an organic material. Some ofthe plurality of layers that constitute the intermediate layer 320, suchas the functional layer(s), integrally extend over a plurality of OLEDs300.

According to an embodiment, the opposite electrode 330 is disposed tocover the display area DA. The opposite electrode 330 is formed as asingle body constituting a plurality of OLEDs 300, and thus correspondsto the plurality of pixel electrodes 310. The opposite electrode 330 maybe a transparent or semi-transparent electrode or a reflectiveelectrode. When the opposite electrode 330 is a transparent orsemi-transparent electrode, the opposite electrode 330 has a metalliclayer that has a small work function, such as Li, Ca, LiF/Ca, LiF/AI,Al, Ag, Mg, or a compound thereof, and a transparent or semi-transparentconductive layer that includes at least one of, e.g., ITO, IZO, ZnO, orIn₂O₃. When the opposite electrode 330 is a reflective electrode, theopposite electrode 330 has a layer that includes at least one of Li, Ca,LiF/Ca, LiF/AI, Al, Ag, Mg, or a compound thereof. The configuration ofthe opposite electrode 330 and the materials included in the oppositeelectrode 330 are not limited to those described above, and in otherembodiments, various modifications may be made to the opposite electrode330.

According to an embodiment, a preset electrical signal is transmitted tothe opposite electrode 330 so that the display apparatus 10 can displayan image. To this end, a voltage line 420 is disposed in the peripheralarea PA that transmits the preset electrical signal to the oppositeelectrode 330. The voltage line 420 is a common power supply voltage(ELVSS).

According to an embodiment, the voltage line 420 is formedsimultaneously when various conductive layers are formed in the displayarea DA, and is formed using the same material as that used to form theconductive layers. In FIG. 2 , the voltage line 420 is disposed on theinterlayer insulating layer 130 in the peripheral area PA. In this case,the voltage line 420 is formed simultaneously on the interlayerinsulating layer 130 with the forming of the source electrode 215 andthe drain electrode 217 using the same material as that used to form thesource electrode 215 and the drain electrode 217. Accordingly, thevoltage line 420 has the same structure as the source electrode 215 andthe drain electrode 217. However, embodiments of the present disclosureare not limited thereto, and various modifications may be made to thevoltage line 420. For example, the voltage line 420 may be formedsimultaneously with the gate electrode 213 using the same material asthat used to form the gate electrode 213 on the gate insulating layer120.

According to an embodiment, the opposite electrode 330 may directlycontacts the voltage line 420, or, as shown in FIG. 2 , may beelectrically connected to the voltage line 420 via a protectionconductive layer 421. The protection conductive layer 421 is disposed onthe planarization layer 140, and extends over the voltage line 420 to beelectrically connected to the voltage line 420. Accordingly, theopposite electrode 330 contacts the protection conductive layer 421 inthe peripheral area PA, and the protection conductive layer 421 contactsthe voltage line 420 in the peripheral area PA.

According to an embodiment, because the protection conductive layer 421is disposed on the planarization layer 140 as shown in FIG. 2 , theprotection conductive layer 421 is simultaneously formed with componentsformed on the planarization layer 140 within the display area DA usingthe same material as that used to form the components on theplanarization layer 140. In detail, the protection conductive layer 421is simultaneously formed on the planarization layer 140 in theperipheral area PA with the pixel electrode 310 within the display areaDA using the same material as that used to form the pixel electrode 310.Accordingly, the protection conductive layer 421 has the same structureas the pixel electrode 310. As shown in FIG. 2 , the protectionconductive layer 421 covers a portion of the voltage line 420 that isexposed by the planarization layer 140. Accordingly, the exposed portionof the voltage line 420 can be prevented from being damaged whileforming a first confining dam 610 or a second confining dam 620.

According to an embodiment, to prevent impurities, such as oxygen ormoisture, from permeating into the display area DA via the planarizationlayer 140, the planarization layer 140 has an opening 140 b within theperipheral area PA, as shown in FIG. 2 . The opening 140 b surrounds thedisplay area DA. When the protection conductive layer 421 is formed, theprotection conductive layer 421 fills the opening 140 b. Accordingly,impurities that would otherwise infiltrate into the planarization layer140 within the peripheral area PA can be effectively prevented fromdoing so.

According to an embodiment, a capping layer 160 that improves efficiencyof the light emitted by the OLED 300 is disposed on the oppositeelectrode 330. The capping layer 160 covers the opposite electrode 330,and extends beyond the opposite electrode 330 in the peripheral area PAto contact the protection conductive layer 421. Because the oppositeelectrode 330 covers the display area DA and extends into the peripheralarea PA, the capping layer 160 also covers the display area DA andextends into the peripheral area PA. The capping layer 160 includes anorganic material.

As described above, according to an embodiment, the capping layer 160improves efficiency of the light emitted by the OLED 300. For example,the capping layer 160 improves efficiency of light extraction out of thedisplay apparatus 10. The efficiency improvement of the capping layer160 is uniformly achieved over the display area DA. Considering this,the capping layer 160 has an upper surface that conforms to theunevenness of an upper surface of a layer therebelow. In other words, asshown in FIG. 2 , an upper surface of a portion of the capping layer 160that is on the opposite electrode 330 has a shape that corresponds to ashape of the upper surface of the opposite electrode 330.

According to an embodiment, an encapsulation layer 500 is disposed onthe capping layer 160. The encapsulation layer 500 protects the OLED 300from external moisture or oxygen. To this end, the encapsulation layer500 extends over the entire display area DA, in which the OLED 300 isdisposed, and into the peripheral area PA. The encapsulation layer 500has a multi-layered structure. In detail, as shown in FIG. 2 , theencapsulation layer 500 includes a first inorganic encapsulation layer510, an organic encapsulation layer 520, and a second inorganicencapsulation layer 530.

According to an embodiment, the first inorganic encapsulation layer 510covers the capping layer 160 and includes at least one of silicon oxide,silicon nitride, or silicon oxynitride. Because the first inorganicencapsulation layer 510 is formed on structures therebelow, the uppersurface thereof is not flat, as shown in FIG. 2 .

According to an embodiment, the organic encapsulation layer 520 coversthe first inorganic encapsulation layer 510 and has a thicknesssufficient to provide an substantially flat upper surface over theentire display area DA. The organic encapsulation layer 520 includes atleast one material selected from polyethylene terephthalate,polyethylene naphthalate, polycarbonate, polyimide, polyethylenesulfonate, polyoxymethylene, polyarylate, or hexamethyldisiloxane.

According to an embodiment, the second inorganic encapsulation layer 530covers the organic encapsulation layer 520 and includes at least one ofsilicon oxide, silicon nitride, or silicon oxynitride. The secondinorganic encapsulation layer 530 extends beyond the organicencapsulation layer 520 in the peripheral area PA and contacts the firstinorganic encapsulation layer 510 such that the organic encapsulationlayer 520 is not externally exposed.

As such, according to an embodiment, since the encapsulation layer 500includes the first inorganic encapsulation layer 510, the organicencapsulation layer 520, and the second inorganic encapsulation layer530, even when the encapsulation layer 500 cracks, due to thismulti-layered structure, this crack may not connect the first inorganicencapsulation layer 510 and the organic encapsulation layer 520 or theorganic encapsulation layer 520 and the second inorganic encapsulationlayer 530. Accordingly, the formation of paths via which externalmoisture, oxygen, etc., can permeate into the display area DA can beprevented or minimized.

According to an embodiment, while the encapsulation layer 500 is beingformed, structures below the encapsulation layer 500 can be damaged. Forexample, the first inorganic encapsulation layer 510 can be formed viachemical vapor deposition. When the first inorganic encapsulation layer510 is formed via chemical vapor deposition, a layer directly therebelowcan be damaged. Accordingly, when the first inorganic encapsulationlayer 510 is directly formed on the capping layer 160, the capping layer160 can be damaged, and the luminescent efficiency of the displayapparatus 10 can be reduced. Accordingly, to prevent damage to thecapping layer 160 while the encapsulation layer 500 is being formed, aprotection layer 170 is interposed between the capping layer 160 and theencapsulation layer 500. The protection layer 170 includes LiF.

As described above, according to an embodiment, the capping layer 160extends not only over the display area DA but also into the peripheralarea PA. Accordingly, the protection layer 170 extends beyond thecapping layer 160 in the peripheral area PA such that the capping layer160 and the encapsulation layer 500 do not directly contact each other.In this case, the protection layer 170 covers an end 160 a of thecapping layer 160 such that an end 170 a of the protection layer 170 ison the planarization layer 140. In detail, as shown in FIG. 2 , the end170 a of the protection layer 170 directly contacts the protectionconductive layer 421, on the planarization layer 140.

Accordingly, according to an embodiment, the first inorganicencapsulation layer 510, which is the lowest of the encapsulation layers500, does not contact the capping layer 160, but contacts the protectionlayer 170. Since the protection layer is formed of an inorganicmaterial, such as LiF, unlike the capping layer, which is formed of anorganic material, a bonding strength between the encapsulation layer 500and a layer therebelow is high. Therefore, while the display apparatus10 is being manufactured or being used, the encapsulation layer 500 iseffectively prevented or minimized from being removed from the layertherebelow.

According to an embodiment, the encapsulation layer 500 is being formed,or in particular, when the organic encapsulation layer 520 is beingformed, the material used to form the organic encapsulation layer 520needs to be confined within a preset area. To this end, as shown in FIG.2 , the first confining dam 610 is located within the peripheral areaPA. In detail, in addition to the gate insulating layer 120 and theinterlayer insulating layer 130, the planarization layer 140 not onlycovers the display area DA of the substrate 100 but also extends intothe peripheral area PA, as shown in FIG. 2 . The first confining dam 610is spaced apart from the planarization layer 140 within the peripheralarea PA.

According to an embodiment, the first confining dam 610 has amulti-layered structure. In other words, the first confining dam 610includes a first layer 611 and a second layer 613 sequentially stackedin a direction above the substrate 100. The first layer 611 issimultaneously formed with the planarization layer 140 using the samematerial as that used to form the planarization layer 140, and thesecond layer 613 is simultaneously formed with the pixel defining layer150 using the same material as that used to form the pixel defininglayer 150.

As shown in FIG. 2 , according to an embodiment, the second confiningdam 620 is further included in addition to the first confining dam 610and is located between the first confining dam 610 and the end 140 a ofthe planarization layer 140. The second confining dam 620 is located ona portion of the protection conductive layer 421 that is disposed on thevoltage line 420. Similar to the first confining dam 610, the secondconfining dam 620 is spaced apart from the planarization layer 140 inthe peripheral area PA. The second confining dam 620 has a multi-layeredstructure like the first confining dam 610, and includes fewer layersthan the first confining dam 610 to have a lower height than the firstconfining dam 610. In FIG. 2 , the second confining dam 620 issimultaneously formed with the second layer 613 of the first confiningdam 610 using the same material as that used to form the second layer613.

Accordingly, according to an embodiment, the organic encapsulation layer520 material is confined by the second confining dam 620, and thus thematerial used to form the organic encapsulation layer 520 can beprevented from overflowing beyond the second confining dam 620 whileforming the organic encapsulation layer 520. Even when the material usedto form the organic encapsulation layer 520 partially overflows thesecond confining dam 620, the organic encapsulation layer 520 materialis further confined by the first confining dam 610, so that the organicencapsulation layer 520 material does not flow toward an edge 100 a ofthe substrate 100. On the contrary, as shown in FIG. 2 , the first andsecond inorganic encapsulation layers 510 and 530 cover the first andsecond confining dams 610 and 620 and extend beyond the first confiningdam 610.

As shown in FIG. 2 , according to an embodiment, a crack-prevention dam630 is disposed in the peripheral area PA. The crack-prevention dam 630extends along at least a portion of the edge 100 a of the substrate 100.For example, the crack-prevention dam 630 surrounds the display area DA.In some sections, the crack-prevention dam 630 is discontinuous. Thecrack-prevention dam 630 prevents a crack from extending into thedisplay area DA. The crack can be generated in the gate insulating layer120 or the interlayer insulating layer 130, due to impacts when a mothersubstrate is cut off while manufacturing the display apparatus 10 orwhen using the display apparatus 10.

According to an embodiment, the crack-prevention dam 630 has variousshapes. As shown in FIG. 2 , the crack-prevention dam 630 issimultaneously formed with some of the components in the display area DAusing the same material as that used to form this components, and has amulti-layered structure. In FIG. 2 , the crack-prevention dam 630 has amulti-layered structure that includes a lower layer 630′ and an upperlayer 630″ disposed on the lower layer 630′. In more detail, in FIG. 2 ,the crack-prevention dam 630 includes a lower layer 630′ that includesthe same material as that included in the gate insulating layer 120, andan upper layer 630″ that includes the same material as that included inthe interlayer insulating layer 130. When a buffer layer is formed onthe substrate 100, this crack-prevention dam 630 further includes alayer that includes the same material as that included in the bufferlayer. As shown in FIG. 2 , a plurality of crack-prevention dams 630 areprovided that are spaced apart from each other.

According to an embodiment, the crack-prevention dam 630 is formed byremoving respective portions of the gate insulating layer 120 and theinterlayer insulating layer 130. In other words, as shown in FIG. 2 , agroove from which the gate insulating layer 120 and the interlayerinsulating layer 130 have been removed is formed on at least one side ofthe crack-prevention dam 630, and the crack-prevention dam 630 isconstituted by remaining portions of the gate insulating layer 120 andthe interlayer insulating layer 130 that are adjacent to the groove.

According to an embodiment, the crack-prevention dam 630 is covered by acover layer 650, as shown in FIG. 2 . For example, the cover layer 650is simultaneously formed with the planarization layer 140 in the displayarea DA using the same material as that used to form the planarizationlayer 140. In other words, the cover layer 650 includes an organicmaterial that covers the crack-prevention dam 630, which includes aninorganic material. The cover layer 650 covers an end of the gateinsulating layer 120 and the interlayer insulating layer 130 and alsothe crack-prevention dam 630.

According to an embodiment, FIG. 3 is a magnified plan view of a portionA of FIG. 1 . FIG. 4 is a schematic plan view of a through portion H ofFIG. 3 , according to an embodiment. FIG. 5 is a cross-sectional viewtaken along line III-III′ of FIG. 4 , according to an embodiment.

According to an embodiment, FIG. 3 illustrates the through portion H andsurroundings of the through portion H. Referring to FIG. 3 , a pluralityof OLEDs 300 electrically connected to data lines DL are disposed in thedisplay area DA around the through portion H, and an area between thethrough portion H and the display area DA is a non-display area PA2 onwhich no image is displayed.

According to an embodiment, each of the data lines DL extends in a firstdirection and is electrically connected to a data driver 1100. Forexample, the data driver 1100 is a chip on panel (COP) type, and may bedisposed in the peripheral area PA of FIG. 1 or disposed on a separateflexible printed circuit board (FPCB) that is electrically connected toa terminal in the peripheral area PA of FIG. 1 .

According to an embodiment, some of the data lines DL that extend in thefirst direction are not straight, due to the through portion H in thedisplay area DA. In this case, the some data lines DL are curved todetour around the through portion H, and the curved data lines DLdetouring around the through portion H are located in the non-displayarea PA2 around the through portion H.

In addition, according to an embodiment, scan lines extend in a seconddirection that cross the data lines DL, and some of the scan lines arealso curved to detour around the through portion H in the area in whichthe through portion H is formed. As another example, the displayapparatus 10 of FIG. 1 includes two scan drivers disposed on both sidesof the display area DA such that scan lines do not need to detour aroundthe through portion H. In other words, scan lines electrically connectedto OLEDs 300 on the left side of the through portion H, and scan lineselectrically connected to OLEDs 300 on the right side of the throughportion H are connected to different scan drivers.

Referring to FIGS. 4 and 5 , according to an embodiment, whichillustrate the through portion H in more detail, at least two grooves G1and G2 that surround the through portion H are formed in the vicinity ofthe through portion H. The through portion H penetrates in a verticaldirection the substrate 100 and a plurality of layers stacked on thesubstrate 100. Although a first groove G1 and a second groove G2surround the through portion H in FIGS. 4 and 5 , embodiments of thepresent disclosure are not limited thereto. In other words, three ormore grooves may be formed. In the following description, two concentricgrooves G1 and G2 are formed around through portion H and are referredto as the first groove G1 and the second groove G2 according to a radialdistance from the through portion H. In other words, a groove that isclosest to the through portion H is referred to as the first groove G1.

According to an embodiment, the first groove G1 surrounds the throughportion H at a position spaced apart from the through portion H. Thefirst groove G1 has an undercut structure. For example, the first grooveG1 is formed by removing respective portions of the second barrier layer104 and the second base layer 103 of the substrate 100. In this state,the second barrier layer 104 includes a pair of first tips T1 that faceeach other and extend toward each other in an upper end portion of thefirst groove G1.

According to an embodiment, after an opening is formed by patterning thesecond barrier layer 104, the second barrier layer 104 is as a maskwhile a laser beam is irradiated toward the second base layer 103 fromabove the second barrier layer 104 or dry etching is performed to removethe second base layer 103. In this way, the first groove G1 is formed,and accordingly portions of the second base layer 103 are removed toform a cavity that is wider than the opening of the second barrier layer104. The width of the first groove G1 denotes a distance measured in aradial direction with respect to a center of the hole, perpendicular toa lengthwise direction of the first groove G1. For example, when thefirst groove G1 has a circular ring shape, the width of the first grooveG1 is in a direction perpendicular to the circumferential direction ofthe circular ring.

In other words, according to an embodiment, a width of the upper endportion of the first groove G1 is less than a width of the interior ofthe bottom portion of the first groove G1, and the second barrier layer104 includes a pair of first tips T1 that face each other, each having acantilever shape in the upper end portion of the first groove G1.

According to an embodiment, because some of the plurality of layers thatconstitute the intermediate layer 320, such as functional layer(s),extend over the plurality of OLEDs 300 as described above, these layersare formed not only in the display area DA but also in the non-displayarea PA2. However, the intermediate layer 320 is not formed on an innerwall surface of the first groove G1 due to the undercut structure formedby the pair of first tips T1, and are only formed on a partial area ofan upper surface of the bottom of the first groove G1. Accordingly,organic layers in the intermediate layer 320 are disconnected by thefirst groove G1, and thus external moisture or oxygen can be preventedfrom infiltrating into the display area DA from the through portion Halong the organic layers in the intermediate layer 320.

According to an embodiment, the second groove G2 surrounds the firstgroove G1 while being spaced apart from the first groove G1. Theconfiguration of the second groove G2 is substantially the same as thatof the first groove G1. In other words, the second barrier layer 104includes a pair of second tips T2 in an upper end portion of the secondgroove G2, and thus the second groove G2 has an undercut structure.Accordingly, when the intermediate layer 320 is formed, the organiclayers in the intermediate layer 320 are disconnected by the secondgroove G2.

According to an embodiment, the non-display area PA2 is divided intothree regions D1, D2, and D3, namely, first, second, and third regionsD1, D2, and D3, based on the first groove G1 and the second groove G2.The first region D1 is between the second groove G2 and the display areaDA, and thus is an area between an end of a second tip T2 closest to thedisplay area DA and the display area DA. Some of the data lines DLdetouring around the through portion H are disposed in the first regionD1. The second region D2 is between the first groove G1 and the secondgroove G2, and thus denotes an area between an end of a second tip T2closest to the first groove G1 and a first tip T1 closest to the secondgroove G2. The third region D3 secures a cutting margin between an endof a first tip T1 closest to the through portion H and the throughportion H, in a process of forming the through portion H.

According to an embodiment, the gate insulating layer 120 and theinterlayer insulating layer 130 in the display area DA and in theperipheral region PA also extend into the first region D1, the secondregion D2, and the third region D3. In addition, the planarization layer140 and the pixel defining layer 150 also extend into the first regionD1 and the third region D3.

According to an embodiment, a flow-restriction portion 700 is disposedin the second region D2. The flow-restriction portion 700 protrudesupward from the substrate 100 in the second region D2. The gateinsulating layer 120 and the interlayer insulating layer 130 arepositioned between the flow-restricting portion 700 and the substrate100. Accordingly, when the organic encapsulation layer 520 is formed,the flow-restriction portion 700 can prevent the organic encapsulationlayer 520 material from flowing toward the first groove G1. When theorganic encapsulation layer 520 material flows over the flow-restrictingportion 700 toward the first groove G1, a refractive index of theflow-restriction portion 700 is changed by the overflowing organicencapsulation layer 520 material, and thus the overflow of the organicencapsulation layer 520 material can be easily ascertained. In thiscase, the flow-restriction portion 700 is simultaneously formed with theplanarization layer 140 or the pixel defining layer 150 using the samematerial as that used to form the planarization layer 140 or the pixeldefining layer 150. Alternatively, the flow-restriction portion 700 hasa multi-layered stacked structure in which a lower layer includes thesame material as that included in the planarization layer 140 and anupper layer includes the same material as that included in the pixeldefining layer 150.

As described above, according to an embodiment, the intermediate layer320 is not formed on the inner wall surfaces of the first and secondgrooves G1 and G2 due to the undercut structures of the first and secondgrooves G1 and G2, but the first inorganic encapsulation layer 510 ofthe encapsulation layer 500, which can be formed via chemical vapordeposition, is formed not only on the inner wall surfaces of the firstand second grooves G1 and G2 but also on lower surfaces of the first andsecond tips T1 and T2. In other words, the first inorganic encapsulationlayer 510 is continuously formed without being disconnected.

According to an embodiment, the organic encapsulation layer 520 fills aninside of the second groove G2. Accordingly, stress concentrated on thesecond tips T2 can be dispersed, and thus damage to the second tips T2can be prevented. Consequently, damage to the first and second inorganicencapsulation layers 510 and 530 due to damage to the second tips T2 canbe prevented.

Moreover, according to an embodiment, a location where the organicencapsulation layer 520 is formed is limited by the flow-restrictionportion 700 in the second region D2, so that an increased amount oforganic encapsulation layer 520 material can be contained in the secondgroove G2, and thus the organic encapsulation layer 520 can be formed toa sufficient thickness on the pixel defining layer 150. Therefore, evenwhen stray particles are present on the pixel defining layer 150, theycan be covered by the organic encapsulation layer 520 and the uppersurface of the organic encapsulation layer 520 can be planarized.Accordingly, damage to the encapsulation layer 500 due to strayparticles can be prevented. For example, the organic encapsulation layer520 of the pixel defining layer 150 can be formed to have a thickness of1 μm or more in the first region D1.

According to an embodiment, the second inorganic encapsulation layer 530is formed similarly to the first inorganic encapsulation layer 510.Thus, the second inorganic encapsulation layer 530 and the firstinorganic encapsulation layer 510 contact each other in the first grooveG1 closest to the through portion H, and accordingly can effectivelyprevent infiltration of external moisture and oxygen.

FIG. 6 is a cross-sectional view taken along line III-III′ of FIG. 4 ,according to another embodiment.

Referring to FIG. 6 , according to an embodiment, the first groove G1surrounds the through portion H at a location spaced apart from thethrough portion H, and the second groove G2 surrounds the first grooveG1 at a location spaced apart from the first groove G1. By having anundercut structure, each of the first and second grooves G1 and G2prevents the intermediate layer 320 from being continuously formed up tothe through portion H, and thus can prevent external moisture or oxygenfrom infiltrating into the display area DA via the organic layers in theintermediate layer 320.

According to an embodiment, the gate insulating layer 120, theinterlayer insulating layer 130, the planarization layer 140, and thepixel defining layer 150 stacked on the substrate 100 extend into thefirst region D1 and the third region D3. Since the flow-restrictionportion 700 is disposed in the second region D2, the organicencapsulation layer 520 can be formed to a sufficient thickness on thepixel defining layer 150. Since the organic encapsulation layer 520fills the inside of the second groove G2, the second tips T2 can beprevented from being damaged by stress.

According to an embodiment, the first and second inorganic encapsulationlayers 510 and 530 extend past the first groove G1 toward the hole H,but the position of the organic encapsulation layer 520 is confined bythe flow-restriction portion 700 formed in the second region D2. If theorganic encapsulation layer 520 extended to the through portion H beyondthe flow-restriction portion 700, external moisture or oxygen caninfiltrate into the display area DA via the organic encapsulation layer520. Accordingly, when the organic encapsulation layer 520 is formed,flow of the organic encapsulation layer 520 material toward the throughportion H needs to be rapidly detected.

To this end, according to an embodiment, a first detection portion 710is formed in the third region D3. In detail, the first detection portion710 is disposed on the pixel defining layer 150 in the third region D3.For example, the first detection portion 710 is a protrusion thatprotrudes upwards from an upper surface of the pixel defining layer 150.The first detection portion 710 may be formed using the same material asthat used to form the planarization layer 140 or the pixel defininglayer 150, but embodiments of the present disclosure are not limitedthereto. The first detection portion 710 may be formed continuously ordiscontinuously in a circumferential direction that surrounds thethrough portion H.

According to an embodiment, when the first detection portion 710 isdisposed on the pixel defining layer 150 in the third region D3 asdescribed above and the organic encapsulation layer 520 material hasreached the third region D3 during formation of the organicencapsulation layer 520, a refractive index of the first detectionportion 710 changes. Thus, it is easily and rapidly determined whetherthe organic encapsulation layer 520 material overflows. In other words,because a defect can be easily ascertained while manufacturing thedisplay apparatus 10, a yield of the display apparatus 10 may improve.

FIG. 7 is a cross-sectional view taken along line III-III′ of FIG. 4 ,according to another embodiment.

Referring to FIG. 7 , according to an embodiment, the through portion His surrounded by the first groove G1 and the second groove G2, and thegate insulating layer 120, the interlayer insulating layer 130, theplanarization layer 140, and the pixel defining layer 150 are present inthe first and third regions D1 and D3. The flow-restriction portion 700is disposed in the second region D2.

According to an embodiment, the first and second inorganic encapsulationlayers 510 and 530 extend beyond the first groove G1 toward the hole H,but position of the organic encapsulation layer 520 is confined by theflow-restriction portion 700 formed in the second region D2. The organicencapsulation layer 520 has a sufficient thickness on the pixel defininglayer 150.

According to an embodiment, a second detection portion 720 is formed inthe third region D3. For example, the second detection portion 720 has aconcave shape that is indented from the upper surface of the pixeldefining layer 150 in a depth direction of the pixel defining layer 150.The second detection portion 720 is formed continuously ordiscontinuously in a circumferential direction that surrounds thethrough portion H.

According to an embodiment, the concave shaped second detection portion720 performs the same function as the first detection portion 710 ofFIG. 6 . In other words, when the organic encapsulation layer 520material reaches the third region D3 and fills a concave portion of thesecond detection portion 720, a refractive index of the second detectionportion 720 changes, and thus it is easily determined whether theorganic encapsulation layer 520 material overflows. Accordingly, defectduring the manufacture of the display apparatus 10 can be easilyascertained. The second detection portion 720, and the first detectionportion 710 of FIG. 6 can be formed together in the third region D3.

FIG. 8 is a cross-sectional view taken along line III-III′ of FIG. 4 ,according to another embodiment.

Referring to FIG. 8 , according to an embodiment, the flow-restrictionportion 700 is disposed in the second region D2 between the first andsecond grooves G1 and G2 that surround the through portion H, and thegate insulating layer 120, the interlayer insulating layer 130, theplanarization layer 140, and the pixel defining layer 150 are present inthe first and third regions D1 and D3.

According to an embodiment, a third detection portion 730 is disposedlocated the first region D1. For example, the third detection portion730 is a protrusion that protrudes upwards from the upper surface of thepixel defining layer 150, and is continuously formed to surround thethrough portion H. As another example, the third detection portion 730is disconnected in a circumferential direction that surrounds thethrough portion H. The protrusion of the third detection portion 730 issimultaneously formed with the pixel defining layer 150. However,embodiments of the present disclosure are not limited thereto, and thethird detection portion 730 may be formed on the pixel defining layer150 via an additional process.

According to an embodiment, the third detection portion 730 can easilydetect whether the organic encapsulation layer 520 material has coatedthe second groove G2 when the organic encapsulation layer 520 is formed.As described above, the organic encapsulation layer 520 needs to fillthe second groove G2. To this end, the organic encapsulation layer 520material needs to coat the outside of the pixel defining layer 150 ofthe first region D1. Accordingly, when changes in a refractive index ofthe third detection portion 730 due to being coated by the organicencapsulation layer 520 material are not detected, it may be determinedthat the coating of the organic encapsulation layer 520 material isdefective.

Moreover, according to an embodiment, the third detection portion 730can reduce a speed at which the organic encapsulation layer 520 materialspreads from the pixel defining layer 150 in a direction toward thesecond groove G2, so that the organic encapsulation layer 520 is formedto have a thickness sufficient to cover stray particles on the pixeldefining layer 150.

According to an embodiment, the first and second inorganic encapsulationlayers 510 and 530 beyond the first groove G1 and contact each other,and accordingly can effectively prevent infiltration of externalmoisture and oxygen.

According to an embodiment, the first detection portion 710 of FIG. 6 orthe second detection portion 720 of FIG. 7 may be formed in the thirdregion D3, or the first detection portion 710 of FIG. 6 and the seconddetection portion 720 of FIG. 7 may be formed together.

FIG. 9 is a cross-sectional view taken along line III-III′ of FIG. 4 ,according to an embodiment.

Referring to FIG. 9 , according to an embodiment, the flow-restrictionportion 700 is disposed in the second region D2 between the first andsecond grooves G1 and G2 that surround the through portion H, and thegate insulating layer 120, the interlayer insulating layer 130, theplanarization layer 140, and the pixel defining layer 150 stacked on thesubstrate 100 are present in the first and third regions D1 and D3.

According to an embodiment, a fourth detection portion 742 is disposedthe first region D1. The fourth detection portion 742 a shape similar tothe third detection portion 730 of FIG. 8 , but protrudes higher thanthe third detection portion 730 of FIG. 8 . For example, a height of thefourth detection portion 742 is equal to a thickness of the pixeldefining layer 150. However, when the fourth detection portion 742protrudes higher than a spacer on the pixel defining layer 150, thefourth detection portion 742 can be, for example, damaged by a maskduring the manufacture of the display apparatus 10. Accordingly, thefourth detection portion 742 is disposed on a stepped portion of thepixel defining layer 150. In detail, an end of the pixel defining layer150 in the first region D1 is etched to have step shape that includes astepped portion 740 that lowers the height of the pixel defining layer150, and the fourth detection portion 742 is located on the steppedportion 740, and thus a final height of the fourth detection portion 742is lowered.

According to an embodiment, the fourth detection portion 742, similar tothe third detection portion 730 of FIG. 8 , enables coating defects ofthe organic encapsulation layer 520 material to be easily ascertained,and reduces the speed at which the organic encapsulation layer 520material flows from the end of the pixel defining layer 150 in thedirection toward the second groove G2. Accordingly, the organicencapsulation layer 520 can be formed to have a sufficient thickness.The fourth detection portion 742 can be formed using a halftone masksimultaneously with the formation of the pixel defining layer 150.

According to an embodiment, the first detection portion 710 of FIG. 6 orthe second detection portion 720 of FIG. 7 can be formed in the thirdregion D3, or the first detection portion 710 of FIG. 6 and the seconddetection portion 720 of FIG. 7 can be formed together.

According to embodiments of the present disclosure, a display apparatusincludes a through portion in which a separate member, such as a camera,is disposed, and at least two grooves that surround the through portion,thereby expanding a display area on which an image is displayed and alsopreventing infiltration of external moisture or oxygen via the throughportion.

According to embodiments of the present disclosure, at least one flowrestriction portion is disposed in the vicinity of the through portionto restrict an area where an organic encapsulation layer is formedduring formation of the organic encapsulation layer, and flow of theorganic encapsulation layer material toward the through portion can beeasily detected.

Of course, embodiments of the present disclosure are not limitedthereto.

It should be understood that exemplary embodiments described hereinshould be considered in a descriptive sense only and not for purposes oflimitation. Descriptions of features or aspects within each embodimentshould typically be considered as available for other similar featuresor aspects in other embodiments.

While one or more embodiments have been described with reference to thefigures, it will be understood by those of ordinary skill in the artthat various changes in form and details may be made therein withoutdeparting from the spirit and scope as defined by the following claims.

What is claimed is:
 1. A display apparatus comprising: a substrate; adisplay area that includes a display device, wherein the display deviceis disposed on the substrate and includes a first electrode; a thin filmtransistor disposed in the display area and electrically connected tothe first electrode; an encapsulation layer disposed on the displaydevice; a through portion surrounded by the display area and thatpenetrates the substrate; a first groove that surrounds the throughportion and is spaced apart from the through portion, wherein the firstgroove exposes a portion of the substrate; a second groove thatsurrounds the first groove and is spaced apart from the first groove,wherein the second groove exposes a portion of the substrate; a firstprotrusion disposed between the first groove and the second groove andthat protrudes upwards from the substrate; a second protrusion disposedbetween the first groove and the through portion and that protrudesupwards from the substrate; and a third protrusion disposed between thesecond groove and the display area and that protrudes upwards from thesubstrate, wherein the second and third protrusions protrude higher fromthe substrate than the first protrusion.